Fresh clues from the Mi Code database point to Xiaomi’s next foldable flagship making a comeback. After scrapping last year’s prototype, the company seems more committed than ever to foldables, with a device that hits a key hardware milestone: Xiaomi’s first foldable running its own silicon.
The Foldable Comeback and XRING O3
Mi Code data lists a new entry with model number 2608BPX34C and internal designation Q18. Within Xiaomi’s naming system, the “18” series is reserved exclusively for Fold devices, making Q18 a clear match for the upcoming Xiaomi MIX Fold 5 (or possibly Xiaomi 17 Fold, though it’s currently tagged as MIX Fold 5).
The biggest surprise is the chipset. The listing confirms the device will run on the XRING O3 processor, following the XRING O1 that launched in the 2025 Xiaomi 15S Pro. This marks Xiaomi’s boldest step yet in custom silicon for premium “Special Edition” China models, reducing dependence on third-party suppliers. For reference, the Xiaomi MIX Flip 3 sticks with a Snapdragon chipset.
The project carries the codename “lhasa.” Last year’s abandoned foldable worked under codename “nirvana” with model O18. By shelving O18 entirely, Xiaomi redirected efforts to “lhasa,” ensuring smooth XRING O3 integration with Xiaomi HyperOS from day one.
Availability
The Xiaomi MIX Fold 5 will launch exclusively in China initially. While exact pricing remains under wraps, analysts anticipate a high-end starting point around $1,399 to take on premium foldable rivals. The model number hints at an August 2026 debut, potentially timed for Xiaomi Day on 8.16 with a special unveiling event.
Dropping the XRING O3 into a flagship foldable shows Xiaomi’s growing trust in its chip team. These processors currently power only top-tier China models, but Xiaomi’s broader plans point toward global XRING devices once the supporting ecosystem fully matures.
